Materiae ad brasandum praecipuae AgCu7.5 adhibentur,AgCu25, AgCu28, AgCu55, etc., etAgCu28Late adhibentur. Bona conductivitate, fluiditate et humectabilitate praeditae sunt, et in industria electrica vacui late adhibentur. Propter resistentiam humilem oneris diuturni sub alta temperatura, tantum ad braseandas partes quarum temperatura operandi minor est quam 400ºC apta est.
Adhibentur ut nummi et ornamenta. Mixturae metallorum adhibitae ut nummi sunt AgCu7.5, AgCu8,AgCu10, etc.; mixturae metallicae ad ornatum adhibitae sunt AgCu8.4, AgCu12.5, etc.
| Ag | Cu | Sn | Ni | Pb | Fe | Sb | Bi | |
| AgCu4 | 96+/-0.3 | 4+0.3/-0.5 | ≤0.005 | ≤0.05 | ≤0.002 | ≤0.002 | ||
| AgCu5 | 95+/-0.3 | 5+0.3/-0.5 | ≤0.005 | ≤0.05 | ≤0.002 | ≤0.002 | ||
| AgCu7.5 | 92.5 +/- 0.3 | 7.5+0.3/-0.5 | ≤0.005 | ≤0.1 | ≤0.002 | ≤0.002 | ||
| AgCu8.4 | 91.6 +/-0.3 | 8.4 +/- 0.5 | ≤0.005 | ≤0.1 | ≤0.002 | ≤0.002 | ||
| AgCu10 | 90+/-0.3 | 10+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu12.5 | 87.5 +/- 0.3 | 12.5 +/- 0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu20 | 80+/-0.3 | 20+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu23 | 77 +/- 0.5 | 23+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu25 | 75+/-0.5 | 25+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu26 | 74+/-0.5 | 26+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu28 | 72 +/- 0.5 | 28+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu50 | 50 +/- 0.5 | 50 +/- 0.5 | ≤0.005 | ≤0.25 | ≤0.002 | ≤0.002 | ||
| AgCu99 | 1+/-0.2 | 99+0.2/-0.5 | ||||||
| AgCu18Ni2 | 80+/-0.5 | 18+/-0.5 | / | 2+/-0.3 |
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