Materiae ad brasandum praecipuae AgCu7.5 adhibentur,AgCu25, AgCu28, AgCu55, etc., etAgCu28Late adhibetur. Bona conductivitate, fluiditate et humectabilitate praedita est, et in industria electrica vacui late adhibetur. Propter resistentiam humilem oneris diuturni sub alta temperatura, tantum ad braseandas partes quarum temperatura operandi infra 400ºC est apta est.
Adhibentur ut nummi et ornamenta. Mixturae metallorum adhibitae ut nummi sunt AgCu7.5, AgCu8,AgCu10, etc.; mixturae metallicae ad ornatum adhibitae sunt AgCu8.4, AgCu12.5, etc.
| Ag | Cu | Sn | Ni | Pb | Fe | Sb | Bi | |
| AgCu4 | 96+/-0.3 | 4+0.3/-0.5 | ≤0.005 | ≤0.05 | ≤0.002 | ≤0.002 | ||
| AgCu5 | 95+/-0.3 | 5+0.3/-0.5 | ≤0.005 | ≤0.05 | ≤0.002 | ≤0.002 | ||
| AgCu7.5 | 92.5 +/- 0.3 | 7.5+0.3/-0.5 | ≤0.005 | ≤0.1 | ≤0.002 | ≤0.002 | ||
| AgCu8.4 | 91.6 +/-0.3 | 8.4 +/- 0.5 | ≤0.005 | ≤0.1 | ≤0.002 | ≤0.002 | ||
| AgCu10 | 90+/-0.3 | 10+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu12.5 | 87.5 +/- 0.3 | 12.5 +/- 0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu20 | 80+/-0.3 | 20+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu23 | 77 +/- 0.5 | 23+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu25 | 75+/-0.5 | 25+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu26 | 74+/-0.5 | 26+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu28 | 72 +/- 0.5 | 28+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu50 | 50 +/- 0.5 | 50 +/- 0.5 | ≤0.005 | ≤0.25 | ≤0.002 | ≤0.002 | ||
| AgCu99 | 1+/-0.2 | 99+0.2/-0.5 | ||||||
| AgCu18Ni2 | 80+/-0.5 | 18+/-0.5 | / | 2+/-0.3 |
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