Materiae ad brasandum praecipuae AgCu7.5 adhibentur,AgCu25, AgCu28, AgCu55, cetera, et AgCu28 late adhibetur. Bona conductivitate, fluiditate et humectabilitate praeditum est, et in industria electrica vacui late adhibetur. Propter resistentiam humilem oneris diuturni sub alta temperatura, tantum aptus est ad partes braseandas quarum temperatura operandi infra 400ºC est.
Adhibentur ut nummi et ornamenta. Mixturae metallorum adhibitae ut nummi sunt AgCu7.5, AgCu8,AgCu10, etc.; mixturae metallicae ad ornamenta adhibitae sunt AgCu8.4, AgCu12.5, etc.
Ag | Cu | Sn | Ni | Pb | Fe | Sb | Bi | |
AgCu4 | 96+/-0.3 | 4+0.3/-0.5 | ≤0.005 | ≤0.05 | ≤0.002 | ≤0.002 | ||
AgCu5 | 95+/-0.3 | 5+0.3/-0.5 | ≤0.005 | ≤0.05 | ≤0.002 | ≤0.002 | ||
AgCu7.5 | 92.5 +/- 0.3 | 7.5+0.3/-0.5 | ≤0.005 | ≤0.1 | ≤0.002 | ≤0.002 | ||
AgCu8.4 | 91.6 +/-0.3 | 8.4 +/- 0.5 | ≤0.005 | ≤0.1 | ≤0.002 | ≤0.002 | ||
AgCu10 | 90+/-0.3 | 10+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu12.5 | 87.5 +/- 0.3 | 12.5 +/- 0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu20 | 80+/-0.3 | 20+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu23 | 77 +/- 0.5 | 23+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu25 | 75+/-0.5 | 25+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu26 | 74+/-0.5 | 26+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu28 | 72 +/- 0.5 | 28+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu50 | 50 +/- 0.5 | 50 +/- 0.5 | ≤0.005 | ≤0.25 | ≤0.002 | ≤0.002 | ||
AgCu99 | 1+/-0.2 | 99+0.2/-0.5 | ||||||
AgCu18Ni2 | 80+/-0.5 | 18+/-0.5 | / | 2+/-0.3 |
150 0000 2421