CUMM7SN aeris Manganese stagni Alloy habena propter chip resistors
Chemical compositionem
MN% | Sn% | Cu% | |
Nomina compositionem | 7 | 2.5 | Bal. |
Physica proprietatibus
Density G / CM3 | 8,5 |
TCR 10-6 / K | ± X |
Elastica modulus GPA | CXXV |
W / (M · K) | 35 |
TERMAL expansion coefficient 10-6 / k | 21,6 |
EMF μV / k | -1 |
Resistentia ohm mm2 / m | 0,29 0.04/- |
Mechanica proprietatibus
Res | CEDITAS | Tensile viribus | Elongatio | Durities |
MPA | MPA | % | HV | |
R350 | - | CCCL | 30 | 70 |